• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
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  • 优先权
    • 专利摘要:
    A junction of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes with shaped substrates are bonded to the submount by applying a force to the substrate in such a way that the shear force in the substrate does not exceed the yield threshold of the substrate. Bonding the light emitting diode to the submount may be provided by applying a force to the surface of the substrate of the light emitting diode that is inclined in the direction of motion of the light emitting diode to thermally bond the light emitting diode to the submount. Also provided is a collet used to bond the shaped substrate to the submount and a system for bonding the shaped substrate to the submount.
    公开号:KR20040029382A
    申请号:KR20047001064
    申请日:2002-07-22
    公开日:2004-04-06
    发明作者:데이비드 슬레이터；자예쉬 바라단；존 에드몬드；마크 라페토；앤워 모하메드；게리 네글레이；피터 앤드류스
    申请人:크리 인코포레이티드；크리 마이크로웨이브 인크.；
    IPC主号:
    专利说明:

    Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
    [3] Light emitting diodes (LEDs) in GaN typically have a substrate of an insulating or semiconductor such as sapphire or SiC, on which a plurality of GaN based epitaxial layers are deposited. The epitaxial layers have an active region with a p-n junction that emits light when electricity is applied. A typical LED is mounted onto a submount with the substrate side down, which is referred to as a package or lead frame (hereinafter referred to as "submount"). 1 schematically shows a conventional LED, which is an n-type SiC substrate 10, a p-GaN base layer 16 grown on the substrate and patterned with mesas and an n-GaN base. It has an active region 12 having a layer 14 of. Metal p-electrode 18 is deposited on p-GaN layer 16 and wire bond connections 28 are made of bond pads 20 on p-electrode 18. The n-electrode 22 on the conductive substrate is attached to the metallic submount 24 using the conductive epoxy 26. In a conventional procedure, conductive epoxy 26 (typically silver epoxy) is deposited on the submount and the LED is pressed into the epoxy 26. The epoxy is then thermally cured and hardened, providing an electrically conductive and stable mounting for the LED chip. Light generated in the active region 12 is oriented above and outside the device. However, a substantial amount of light generated can be transferred into the substrate and absorbed by the epoxy 26.
    [4] Flip chip mounting of the LEDs includes mounting the LED to the submount with the substrate side up. Light is then extracted and irradiated through the transparent substrate. Flip chip mounting may be a particularly desirable technique for mounting LEDs, in particular SiC based. Since SiC has a higher refractive index than GaN, light generated in the active region does not reflect internally at the interface of GaN / SiC (ie, it is not reflected back into the GaN base layer). Flip chip mounting of SiC based LEDs may enhance the effectiveness of certain chip forming techniques known in the art. Flipchip packaging of LEDs of SiC may have other advantages, such as improved heat dissipation, which may be desirable depending on the particular application to the chip.
    [5] The problem of flip chip mounting is as shown in FIG. That is, when the chip is flip chip mounted onto a conductive submount or package using conventional techniques, the conductive die attach material 6 is deposited on the chip and / or submount 24 and the chip is mounted on the submount ( 24) pressurized into. This causes the viscous conductive die attach material 26 to squeeze out and contact the n-type layers 14 and 10 in the device, thereby shunt to the pn junction in the active region with predictably undesirable results. To form a Schottky diode connection. Therefore, new technology for flip chip mounting of LEDs may be needed.
    [1] This application claims the priority of US Provisional Application No. 60 / 307,234 "Thermal Ultrasonic Bonding of a Flip Chip Light Emitting Diode" (2001.7.23), the disclosure of which is incorporated herein as disclosed herein.
    [2] TECHNICAL FIELD The present invention relates to semiconductor devices, and more particularly, to devices used to mount semiconductor devices in a submount in a flip-chip configuration.
    [26] 1 is a schematic diagram of a conventional LED.
    [27] 2 is a schematic diagram of a flip-chip mounted LED using conventional techniques.
    [28] 3 is a schematic diagram of an LED with a shaped substrate.
    [29] 4 is a top view of an LED with a shaped substrate.
    [30] 5A and 5B are side and top views of a collet according to an embodiment of the present invention.
    [31] 6 is a side view of a collet according to another embodiment of the present invention.
    [32] 7 is a side view of a collet according to another embodiment of the present invention.
    [6] Embodiments of the present invention provide for the bonding of flip-chip mounted light emitting devices having irregular configurations. Certain embodiments of the present invention bond a light emitting diode with a shaped substrate to a submount by applying a force to the substrate in such a way that the shear force in the substrate does not exceed the yield threshold of the substrate. Such bonding may be provided, for example, by thermosonic and / or thermocompression bonding. In a particular embodiment of the invention, the light emitting diode is bonded to the submount by applying a force to the substrate surface of the light emitting diode inclined in the direction of motion of the light emitting diode that bonds the light emitting diode to the submount.
    [7] In a particular embodiment of the invention, a force is applied to the shaped substrate by corresponding the collet to the surface of the substrate inclined in the direction of movement and moving the collet in the direction of movement. Corresponding such a collet may be provided by seating the collet with a corresponding surface corresponding to the inclined surface of the substrate such that the corresponding surface of the collet contacts the inclined surface of the substrate. In a particular embodiment of the invention, the corresponding surface of the collet is a surface fixed relative to the body of the collet. In another embodiment of the invention, the corresponding surface of the collet is a surface that is movable relative to the body of the collet.
    [8] In another embodiment of the invention, the collet is seated by placing the collet over the light emitting diode and applying a vacuum pressure to the collet. In a particular embodiment of the invention, the light emitting diode is a gallium nitride based light emitting diode having a silicon carbide shaped substrate. In particular, the shaped substrate of silicon carbide may have a cube portion and a topped pyramid portion proximate the cube portion. In such a case, a force is applied to the sidewall of the pyramid portion cut off the top of the silicon carbide substrate.
    [9] In another embodiment of the present invention, a collet is provided for bonding a light emitting diode having a formed substrate to a submount. The collet has a chamber and a body having an opening in communication with the chamber and adapted to receive a light emitting diode. The collet also has means for causing the surface of the collet to correspond to the surface of the shaped substrate inclined to the direction of movement of the collet.
    [10] In a particular embodiment of the invention, means for matching the surface of the collet to the shaped substrate is provided by a fixed surface of the collet, which is defined by the surface angle of the shaped substrate that defines the opening and is inclined in the direction of motion. It is arranged at the corresponding angle. Moreover, the body can have a vertical side portion and an upper portion defining a chamber and an opening for attracting a vacuum in the chamber.
    [11] In another embodiment of the present invention, the body has spaced side portions defining the chamber. In such an embodiment, the fixed surfaces of the collet may be provided by an angled surface at the ends of the side portions. Moreover, the side portions can be spaced at a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of motion. In such embodiments, the body may also have an upper portion and an opening for attracting a vacuum pressure in the chamber.
    [12] In another embodiment of the invention, the body has a top portion and a vertical side portion defining an opening for attracting a vacuum into the chamber and the chamber. In such embodiments, the side portion may be a horizontal side portion extending from the vertical side portion and spaced from the upper portion.
    [13] In another embodiment of the invention, the means for causing the surface of the collet to correspond to the shaped substrate is controlled at an angle corresponding to the surface angle of the shaped substrate that is defined in the opening and is movable relative to the body and is inclined in the direction of movement Provided by the surface of the collet. In such embodiments, the fuselage may have an upper portion and a vertical side portion that defines the chamber and an opening that introduces a vacuum into the chamber. Moreover, the fuselage may have horizontal side portions spaced apart. In such a case, the movable surfaces of the collet may be provided by the movable end portions of the horizontal side portions, the movable end portions being configured to substantially correspond to the angle of the shaped substrate and the direction of movement Spaced at a distance corresponding to the surface dimensions of the shaped substrate at an angle to it.
    [14] In a particular embodiment of the invention, the movable end portions are hinged to rotate around the ends of the horizontal side portions. In another embodiment of the invention, the fuselage further comprises an upper portion and a vertical side portion, the vertical side portion having an upper portion on a horizontal side portion defining a chamber and an opening for attracting vacuum pressure in the chamber. Connect it. Horizontal side portions may also be movably connected to vertical side portions. For example, the horizontal side portions can be hinged to the vertical side portions.
    [15] In certain embodiments of the invention, the collet is adapted for use with a gallium nitride based light emitting diode having a silicon carbide shaped substrate. The collet may be adapted for use with a silicon carbide shaped substrate having a topped pyramid portion, and the means for correspondence means for matching the surface of the collet to the sidewall of the topped pyramid portion of the shaped silicon carbide substrate. It is provided.
    [16] Another embodiment of the present invention provides a collet for bonding a light emitting diode having a shaped substrate to a submount. The collet has a fuselage with an opening in the fuselage in communication with the chamber configured to extend into the chamber without a portion of the shaped substrate contacting the fuselage. The collet is also operatively associated with the chamber and includes means for engaging the substrate to bond the light emitting diode to the submount while maintaining the shear force of the substrate below the shear yield threshold of the substrate.
    [17] In some embodiments of the invention, the means for engagement is provided by a fixed surface of the collet which is disposed at an angle corresponding to the surface angle of the shaped substrate inclined in the direction of movement and which defines the opening. In such embodiments, the fuselage may have an upper portion and a vertical side portion that defines the chamber and an opening that introduces a vacuum into the chamber. In another embodiment, the fuselage has spaced side portions defining an opening and the fixed surfaces of the collet have angled surfaces at the ends of the side portions, and the side portions are surfaces of the shaped substrate slanted in the direction of motion. Spaced at a distance corresponding to the dimension. In such embodiments, the fuselage has a chamber and an upper portion defining an opening for inducing vacuum in the chamber and the side portion may be a vertical side portion. In other embodiments of the invention, the fuselage has a side portion perpendicular to the upper portion and an opening for attracting a vacuum into the chamber, the side portions extending horizontally from the vertical side portions and spaced apart from the upper portion. Side parts.
    [18] In another embodiment of the invention, the interlocking means is provided by a movable surface of the collet configured to be adjusted at an angle corresponding to the surface angle of the shaped substrate inclined in the direction of movement and defining the opening. In such embodiments, the fuselage may have an upper portion and a vertical side portion that defines the chamber and an opening that introduces a vacuum into the chamber. The fuselage may also have spaced horizontal side portions and the movable surfaces of the collet are configured to substantially fit the angle of the shaped substrate and spaced at a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of motion. To define the opening. In certain embodiments, the movable end portions are hinged to rotate around the ends of the horizontal side portions. In such an embodiment, the fuselage may have an upper portion and an opening for attracting a vacuum in the chamber and a vertical side portion connecting the upper portion to the horizontal side portion. Moreover, horizontal side portions may be movably connected to vertical side portions. For example, the horizontal side portions can be hinged to the vertical side portions.
    [19] In other embodiments of the present invention, the collet for bonding the light emitting diode to the submount includes a chamber, an opening configured to receive the light emitting diode in communication with the chamber, and fixing the collet in the opening contacting the shaped substrate of the light emitting diode. And provided with fixed surfaces, wherein the fixed surfaces are disposed at an angle corresponding to the surface angle of the shaped substrate inclined to the direction of motion of the collet during defining and bonding the opening. In some embodiments of the invention, the fuselage has spaced side portions and the fixed surfaces of the collet may be angled surfaces at the ends of the side portions. The side portions are spaced at a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of motion. In another embodiment of the invention, the body has a top portion and a vertical side portion defining a chamber and an opening for introducing a vacuum into the chamber. In such an embodiment, the side portions may be horizontal side portions extending from vertical side portions and spaced apart from the upper portion.
    [20] In other embodiments of the invention, a collet for bonding the light emitting diode to the submount is in contact with the chamber, an opening in the fuselage in communication with the chamber and configured to receive the light emitting diode, and in contact with the shaped substrate. And a fuselage with movable surfaces of the collet in the opening, the movable surface configured to be adjusted to an angle corresponding to the surface angle of the shaped substrate inclined to the direction of motion of the collie during bonding. In certain embodiments of the invention, the body has spaced horizontal side portions and the movable surfaces of the collet are movable end portions of the horizontal side portions, the movable end portions being the angle of the shaped substrate. Are spaced at distances corresponding to the surface dimensions of the shaped substrate that are configured to substantially fit and inclined in the direction of motion. In some embodiments, the movable end portions are hinged to rotate about the ends of the horizontal side portions. In other embodiments of the invention, the fuselage has an upper portion defining the chamber, an opening for introducing a vacuum in the chamber, and vertical side portions connecting the upper portion to horizontal side portions. In such embodiments, the horizontal side portions can be movably connected to the vertical side portions. For example, the horizontal side portions can be hinged to the vertical side portions.
    [21] In other embodiments of the present invention, a system is provided for bonding a light emitting diode having a shaped substrate to a submount. The system includes means for engaging the substrate while maintaining the internal shear force of the substrate below the shear yield threshold of the substrate when the force is applied to the shaped substrate to bond the light emitting diode to the submount, and the force to bond the light emitting diode to the substrate. Means for moving the engagement means to apply the force to the substrate. In certain embodiments of the present invention, the engaging means comprises means for contacting the shaped substrate on the surface of the shaped substrate inclined to the direction of motion of the shaped substrate. In other embodiments of the invention, the means for contacting is provided by the wall of the collet in a fixed position relative to the body of the collet, the collet being configured to receive the light emitting diode. In another embodiment of the invention, the means for contacting is provided by a wall of collet that is movable relative to the body of the collet, the collet being configured to receive a light emitting diode.
    [22] In another embodiment of the present invention, a collet is provided for bonding a light emitting diode having a shaped substrate to a submount. The collet has a chamber and a body having an opening in communication with the chamber and adapted to receive a light emitting diode. The opening has a portion proximate to the chamber and a portion that is end of the chamber. The collet is also disposed at an inclined angle with respect to the axis connected with the distal end of the opening that is equivalent to the surface of the shaped substrate and has a corresponding surface associated with the opening.
    [23] In another embodiment, the corresponding surfaces are fixed surfaces of the collet defining an opening and disposed at an angle corresponding to the angle of the surfaces of the shaped substrate. Moreover, the fuselage may have an upper portion and vertical side portions that define the chamber and an opening that introduces a vacuum into the chamber. The fuselage may be a spaced side portion defining the chamber and the fixed surfaces of the collet may be angled surfaces at the ends of the side portions. The side portions are spaced apart by distances at which the fixed surfaces correspond to the surface dimensions of the corresponding shaped substrate. The body may have an upper portion and an opening for inducing vacuum pressure in the chamber and the side portions may be vertical side portions. The side portions may also have horizontal side portions extending from the vertical side portions and spaced apart from the upper portion.
    [24] In other embodiments of the invention, the corresponding surfaces are provided by the surfaces of the collet defining the opening and are movable relative to the fuselage and the surfaces of the collet defining the opening correspond to the surface angle of the corresponding shaped substrate. It is configured to be adjusted at an angle. The body may have upper side portions and vertical side portions that define the chamber and an opening that draws vacuum into the chamber. The body may also have spaced horizontal side portions and the movable surfaces of the collet may be movable end portions of the horizontal side portions. The movable end portions can be configured to substantially fit the angle of the shaped substrate and the movable end portions can be spaced at a distance corresponding to the surface dimension of the shaped substrate to which it is fitted. The moveable end portion can be hinged to rotate around the ends of the horizontal side portions. The body may also have vertical side portions that connect the upper portion to horizontal side portions that define the chamber. Horizontal side portions are movably connected to vertical side portions. For example, the horizontal side portions can be hinged to the vertical side portions.
    [25] In certain embodiments of the invention, the collet is adapted for use with gallium nitride based light emitting diodes having a shaped substrate of silicon carbide. The collet may also be adapted for use with a shaped carbide substrate having a topped pyramid portion and the corresponding surfaces corresponding to the angled sidewalls of the topped pyramid portion of the shaped silicon carbide substrate.
    [33] The invention will be described in more detail hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout. Moreover, the various layers and regions shown in the figures are schematically illustrated. As will be appreciated by those skilled in the art, reference herein to a layer formed “on” of a substrate or other layer may refer to a layer formed directly on top of the substrate or other layer or other layer or intervening formed on the substrate or other layer. May be referred to as a layer. Accordingly, the present invention is not limited to the distances and relative sizes shown in the accompanying drawings.
    [34] Embodiments of the present invention provide for bonding an LED chip to a submount. Embodiments of the present invention include a method of joining shaped chips thermothermally and / or by thermocompression, and designing collets for manipulating the shaped chips. In a particular embodiment of the invention, the chip or die is picked up and / or bonded on a single tool, and a single collet for picking up the die and bonding the die by thermosonic and / or thermocompression bonding. Can be used.
    [35] Because of the high refractive index of SiC, light passing through the SiC substrate tends to be totally internally reflected into the substrate at the surface of the substrate unless the light strikes the interface at very low angles of incidence (ie, very close to the normal). The critical angle for internal reflection depends on the material from which SiC forms the interface. By allowing more rays to strike the surface of the SiC at low angles of incidence, it is possible to shape the SiC substrate in a manner that limits the overall internal reflection to increase the light output from the SiC base LEDs. Such chip forming techniques and resulting chips are disclosed in US Patent Application No. 10 / 057,821 "Light Emitting Diodes Comprising Substrate Improvement for Light Extraction, and Methods for Manufacturing Them" (2002.1.25) Incorporated herein.
    [36] 3 shows an LED chip with a shaped substrate as described in the patent application referenced above. In particular, the LED chip 3 shown in FIG. 3 has a substrate 10 having a first surface 21 and a second surface 23. The active region 12 of the luminous means is formed by a GaN-based n-type layer 14 and a p-type GaN-based layer 16 on the first surface 21. The p-type electrode is on layer 16 of the p-type GaN base. The n-type electrode 22 is on the second surface 23 of the substrate 10. The substrate 10 is characterized by an inclined sidewall 15, which is cut off entirely so that the base of the cut pyramid is either directly adjacent to, or spaced apart from, the first surface 21. The pyramid shape 19 is formed. The shaped substrate 10 is further characterized by an overall mouth portion 25 with side walls 17, each of which forms an angle φ with an adjacent inclined side wall portion 15. 4 shows a top view of the shaped substrate chip 30 of FIG. 3. The LED chip 30 further includes a metal pad 31 that can be thermosonically bonded to the submount. The metal pad 31 is preferably provided with a suitable metal alloy such as Au or Au / Sn or Pb / Sn.
    [37] Embodiments of the invention are described herein with reference to a GaN based LED on an SiC substrate 10 and having an n-type layer 14, a p-type layer 16, and a p-electrode 18. Explained However, the present invention should not be construed as limited to such structures and can be used with other structures having shaped substrates. The light emitting device used in the embodiment of the present invention may be a gallium nitride based LED or laser fabricated on a silicon carbide substrate, such as those manufactured and marketed by Cree of Durham, NC. For example, the present invention discloses US patents 6,201,262, 6,187,606, 6,120,600, 5,912,477, 5,739,554, 5,631,190, 5,604,135, 5,523,589, 5,416,342, 5,393,993, It may be suitable for use with LEDs and / or lasers as disclosed in 5,338,944, 5,210,051, 5,027,168, 4,966,862, and / or 4,918,497, which are incorporated by reference as disclosed herein. Other suitable LEDs and / or lasers are described in U.S. Provisional Application No. 60 / 294,445 "Multi-Quantum Light Emitting Diode Structure" (2001.5.30) and U.S. Provisional Application No. 60 / 294,308 "Light Emitting Diode Structure with Superlattice Structure" ( May 30, 2001), US Provisional Application No. 60 / 294,378, "Light Emitting Diode Structure with Multiple Quantum Wells and Superlattice Structures" (2001.5.30), and US Provisional Application No. 60 / 265,707, "Optically Transparent. Silicon Carbide Substrate "(2001.2.1), US Provisional Application No. 60 / 307,235" Light Emitting Diodes with Modification for Light Extraction, and Methods for Manufacturing the Same "(2001.1.23), and US Patent Application No. 10 / 057,821, "Light Emitting Diodes Including Substrate Modifications for Light Extraction, and Methods for Making the Same" (2002.1.25.), Which are incorporated as disclosed herein.
    [38] In a particular embodiment of the invention, the light emitting device can have a p-electrode which provides a reflective layer for reflecting light generated in the active region back through the device. The structures associated with the reflective p-electrode are described in US patent application Ser. No. 10 / 057,821, "Light Emitting Diode Modified Substrate for Light Extraction and a Method for Manufacturing It" (January 25, 2002) (Agent No. 5308-162) Which is incorporated herein by reference as disclosed herein.
    [39] Thermosonic bonding is a technique in which a device is mounted on a substrate or submount using mechanical vibrations, heat and pressure as a whole, creating a conductive bond between the device and the submount. Typically, a vacuum collet is used to pick up the device and physically place it in contact with the submount. Once the device is in contact with the submount, force is applied to the device through the collet, and the collet is vibrated for thermosonic bonding. Through a combination of heat, vibration, and pressure, the device is thermally ultrasonically welded to the submount. To form such a junction, a metal pad layer made of a metal such as Au, which will form the junction when heat, pressure and optionally vibration is applied, is used. Other potential metals and alloys are Au / Sn and Pb / Sn. A metal pad layer may be provided over the device, or a metallic preform may be provided on the submount and the metal pad and / or metallic preform is thermosonically bonded and / or thermocompressed. As a result, the element and the submount are joined to each other.
    [40] Due to the unusual shape of the shaped substrate chip, such as the LED chip 30 shown in FIG. 3, a conventional collet design in contact with the sidewall 17 of the cube portion 25 may be undesirable. For example, if a conventional collet was used to mechanically vibrate the chip while it was only attached to the cube portion 25, the shear force generated during the vibration could separate the cube portion 25 from the chip, making the chip useless. Decreases yield.
    [41] In view of the above difficulties which may be encountered using conventional vacuum collets for thermosonic and / or thermocompression bonding of a light emitting element with a shaped substrate to a submount, certain embodiments of the invention Bonding a light emitting device having a shaped substrate using a vacuum collet in contact with the shaped substrate in a manner that reduces the shear force at the substrate when applying a force to the substrate. Such force can be reduced below the yield threshold, for example below the threshold that causes the substrate to break. The particular yield threshold may depend on the configuration of the shaped substrate and the material from which the substrate is made. Thus, for the shaped substrate of FIG. 3, embodiments of the present invention apply force to the substrate 10 by contacting at least a portion of the inclined sidewall 15 of the pyramid portion 19, which is cut off of the substrate 10. Will be added. Examples of collets according to embodiments of the invention are shown in FIGS. 5A-7 and will be described in more detail herein. Such collets may contact at least the sidewall 15 of the pyramid portion 19, which is cut off the top of the substrate 10, and optionally may contact the sidewall 17 of the cube portion 25 of the substrate 10. .
    [42] 5A and 5B show collet 40 in accordance with an embodiment of the present invention. FIG. 5A is a cross section of the collet 40 shown in the plane of FIG. 5B and taken along line 5a-5a ′. The collet 40 has a body 45 having a body 41 having a side wall 42 of resin connected to an upper wall 43 to define a chamber 45 having an opening 47 in communication with a chamber 45 containing a light emitting element. Form. The upper wall 43 has an opening 46 into the chamber 45 through which vacuum is drawn. The horizontal portion 44 extends inwardly from the side wall 42 of the collet 40. The horizontal portion 44 has an end face 48 that is in physical contact with the inclined sidewall 15 of the substrate 10 when the collet is disposed over the LED chip 30. The end face 48 of the horizontal parts 44 is the spacing of the horizontal parts 44, and the end faces 48 of the horizontal parts 44 are opposite of the top or bottom of the end faces 48. It may be configured to contact the side wall 15 based on an angle made with respect to the plane connected with the. If the end faces 48 are the same length, the plane connecting the top or bottom of the end faces will be parallel. The angle that the end faces 48 make with the connection plane can be made based on the angle φ made by the side wall 15 with the side wall 17. This angle may be substantially equal to the subtraction of 90 ° from φ. Alternatively, the angle of the end faces can be measured with respect to an axis perpendicular to the connecting plane as shown in FIG. 4, which angle can be substantially equal to φ. The horizontal portions 44 should be spaced enough to allow the cube portion 25 of the LED chip 30 to pass therebetween, but not wide enough to allow the topped pyramid portion 19 to pass therebetween.
    [43] The collet 40 may have a single integrated member to provide the configuration shown in FIG. 5 or may have two or more interconnected members. Moreover, collet 40 may be made of a metallic material such as aluminum, steel, or the like, or may be made of a nonmetallic material such as plastic, ceramic, or other nonmetallic material. The collet 40 may be manufactured by casting, machining, molding, combinations thereof, or other suitable manufacturing process.
    [44] In operation, the collet 40 may be configured such that the cube portion 25 of the substrate 10 extends into the chamber 45 and the end face 48 contacts the sidewall 15 of the substrate 10. Is placed up). By contacting the end face 40, a hermetic seal can be formed between the end face 48 of the collet 40 and the inclined sidewall portion 15 of the LED chip 30. The vacuum pressure applied to the collet 40 through the opening 46 sets a low pressure site in the exchanger 45 and serves to hold it firmly in place while the LED chip 30 is being operated.
    [45] The movement of the collet 40 can be used to thermosonically bond the LED chip 30, but the force applied to the LED chip 30 is applied to the inclined sidewalls 15, thereby reducing the The shear force is reduced at the boundary between the topped pyramid portion 19 and the cube portion 25. Thus, in a particular embodiment of the invention, the LED chip 30 is thermosonically by the application of a force in contact with the surface of the substrate 10 of the chip 30 inclined in the direction of motion of the LED chip 30. Are bonded. The angle of contact with the substrate 10, in which force is applied to the LED chip 30, may be an acute or obtuse angle with respect to the direction of motion.
    [46] Likewise, the LED chip 30 may be thermosonically bonded using the collet 40 by the application of a force to the pyramid portion 19 of the substrate 10. Such force may be applied through the end face 40 of the collet 40.
    [47] A collet design according to another embodiment of the present invention is shown in FIGS. 6 and 7. In FIG. 6, the horizontal portion 44 of FIG. 5 has been replaced in the collet 50 shown in FIG. 6 by the longitudinal section of the side portion 51. The collet 50 has a body 61 having a vertical side wall 52 connected to the upper wall 53 to communicate with the chamber 55 and the opening 57 in communication with the chamber 55 containing the light emitting element. To form. The upper wall 53 has an opening 56 to the chamber 55 through which vacuum is drawn. As shown in FIG. 6, the vertical sidewalls 52 of the side portions 51 terminate at the inclined end face 58. The end face 58 of the side part 51 is a plane which connects the spacing of the side part 51 and the opposing ones of the top or bottom of the end face 58 with the end face 58 of the side part 51. It may be configured to contact the side wall 15 based on the angle it makes with respect to. If the end faces 58 are the same length, the planes connecting with the top or bottom of the end faces will be parallel. The angle that the end faces 58 make with the connection plane can be based on the angle φ made by the side walls 15 with the side wall 17. This angle is substantially equal to φ-90 °. Alternatively, the angle of the end face 58 can be measured about an axis perpendicular to the connecting plane as shown in FIG. 6, with the angle being substantially equal to φ. The side portions 51 should be spaced at a distance sufficient to allow the cube portion 25 of the LED chip 30 to pass between them, but not wide enough to allow the topped pyramid portion 19 to pass therebetween. Is not.
    [48] The collet 50 may have a single integrated member to provide the configuration as shown in FIG. 6 or may have two or more members connected to each other. Moreover, collet 50 may be made of a material of a metal such as aluminum, steel or the like, or may be made of a nonmetallic material such as plastic, ceramic or other nonmetallic material. The collet 50 may be manufactured by casting, machining, molding, combinations thereof, or other suitable manufacturing process. 7 shows another collet 70 in accordance with embodiments of the present invention. In the collet 70 of FIG. 7, the horizontal portion 74 is a collet (even if the collet is slightly misaligned or slightly deviated from the angle of the movable end portions 77 with the angle of the inclined sidewalls 15). 70 has an end portion 77 hinged to form a hermetic seal with the inclined portions 15 of the LED chip 30. The collet 70 has a body 71 having a vertical sidewall 72 connected to the top wall 73 so as to receive the light emitting element substrate 10 as shown in FIG. 7, and An opening 80 is formed in communication with the chamber 79. The upper wall 73 has an opening 76 into the chamber 79 through which vacuum is drawn. As shown in FIG. 7, the horizontal portion 74 can be hinged about an individual pivot point 75 to rotate about an individual pivot point 75. Likewise, the end portions 77 may be hinged to pivot about the pivot point 78 to allow the end portion 77 to mate with the inclined surface of the inclined portion 15 of the LED chip 30. Can be.
    [49] The collet 70 may have a single integrated member to provide the configuration as shown in FIG. 7 or may have two or more members connected to each other. Moreover, collet 70 may be made of aluminum, steel, or similar metallic material, or may be made of nonmetallic material such as plastic, ceramic, or other nonmetallic material. The collet 70 may be manufactured by casting, machining, molding, combinations thereof, or other suitable manufacturing process.
    [50] For collets according to embodiments of the present invention, as illustrated by collets 40, 50, 70, the size of the openings 46, 56, 76 may be such that the size of the lower pressure can be maintained. 50 or 70 can be made large enough to overcome any imperfection in making the substrate 10 small. Such size may require different configurations of the collet 40 to allow larger openings, for example for application of vacuum pressure. Thus, the particular configuration of the collet may be improved so that most of the pressure drop between the openings 46, 56 or 76 and the external environment is provided across any of the openings or incomplete portions of the contact area between the collet and the substrate 10. Can be. In that way, the substrate 10 can be retained in the collet 40, 50 or 70 through the application of vacuum pressure for movement and / or bonding.
    [51] As described above, embodiments of the present invention provide a means for mating the surface of a collet to a shaped substrate. Embodiments of the present invention also provide a means for engaging a substrate while maintaining the internal shear force of the substrate below the yield threshold of the substrate when a force is applied to the substrate shaped to thermosonically bond the light emitting diode to the submount. . The means for mating with the substrate and / or the means for engaging the substrate may be movable and adjustable, either by fixed surfaces of the collet or in contact with the shaped substrate at an inclined angle with respect to the movement of the collet. And / or may be provided by conforming surfaces. Moreover, while the present invention has been described with reference to a rectangular chamber formed by a collet, other shapes may be used. Thus, for example, a topped chamber may be formed, or some other shape may be provided that provides a cavity in which the light emitting diode may be accommodated.
    [52] In another embodiment of the present invention, a system for thermoelectrically and / or thermocompression bonding a light emitting diode having a shaped substrate to a submount is provided. In certain systems, the collets described above can be used with conventional systems for thermosonic and / or thermocompression bonding. Thus, conventional systems may provide a means for moving the collet to apply force to the substrate to bond the light emitting diode to the submount thermosonically and / or thermocompressionally.
    [53] Moreover, although embodiments of the present invention have been described with reference to shaped substrates having portions of the cube and topped pyramid portions, other shaped substrates may be used with corresponding changes in shape relative to the perimeter of the chamber. have. Thus, for example, the substrate may have a cylindrical portion and a truncated conical portion and / or a conical portion. In such cases, embodiments of the present invention may provide a substantially circular opening in the chamber, wherein the sidewalls of the opening are configured to mate with the sidewalls of the conical and / or truncated conical portions of the substrate. Accordingly, embodiments of the present invention should not be construed as limited to the specific shapes described herein.
    [54] In the drawings and the description, typical preferred embodiments of the invention have been described, and although specific terms are used, these are merely general and used in the sense of the description and the scope of the invention is set forth in the following claims. .
    [55] The invention can be used in light emitting diodes.
    权利要求:
    Claims (67)
    [1" claim-type="Currently amended] A method of thermally bonding a light emitting diode to a submount,
    Applying a force to a substrate surface of the light emitting diode inclined in the direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount.
    [2" claim-type="Currently amended] The method of claim 1,
    The steps to apply the force are:
    Matching the collet to the substrate surface inclined to the direction of movement; And,
    Moving the collet in the direction of movement.
    [3" claim-type="Currently amended] The method of claim 2,
    Mating the collet such that the corresponding surface of the collet contacts the inclined surface of the substrate comprises seating the collet having a corresponding surface corresponding to the inclined surface of the substrate.
    [4" claim-type="Currently amended] The method of claim 3, wherein
    The corresponding surface of the collet is a surface fixed relative to the body of the collet.
    [5" claim-type="Currently amended] The method of claim 3, wherein
    The corresponding surface of the collet is a surface that is movable relative to the body of the collet.
    [6" claim-type="Currently amended] The method of claim 3, wherein
    The steps to seat the collet are:
    Placing the collet on top of the light emitting diode; And,
    Applying a vacuum pressure to the collet.
    [7" claim-type="Currently amended] The method of claim 1,
    Wherein the light emitting diode comprises a gallium nitride based light emitting diode having a silicon carbide shaped substrate.
    [8" claim-type="Currently amended] The method of claim 7, wherein
    The shaped substrate of silicon carbide has a cube portion and a topped pyramid portion proximate the cube portion, and applying the force comprises applying a force to the sidewall of the pyramid portion cut off the top of the silicon carbide substrate. How to.
    [9" claim-type="Currently amended] A collet for bonding a light emitting diode with a shaped substrate to a submount,
    Fuselage with chamber;
    An opening adapted to be in communication with the chamber and receive the light emitting diode; And,
    And means for matching the surface of the collet to the surface of the shaped substrate inclined to the direction of movement of the collet.
    [10" claim-type="Currently amended] The method of claim 9,
    The means for mapping the surface of the collet to the shaped substrate comprises a fixed surface of the collet disposed at an angle corresponding to the surface angle of the shaped substrate inclined in the direction of movement and defining the opening.
    [11" claim-type="Currently amended] The method of claim 10,
    The fuselage has a vertical side portion defining an upper portion and an opening for attracting the chamber and the vacuum in the chamber.
    [12" claim-type="Currently amended] The method of claim 10,
    The fuselage has a spaced side portion defining the chamber, the fixed surfaces of the collet have an angled surface at the distal end of the side portion, the side portions corresponding to a surface dimension of the shaped substrate inclined in the direction of motion. Collet, characterized in that spaced apart.
    [13" claim-type="Currently amended] The method of claim 12,
    The fuselage further comprises an upper portion and an opening for attracting vacuum pressure in the chamber, wherein the side portions are vertical side portions.
    [14" claim-type="Currently amended] The method of claim 12,
    The fuselage has an upper side and vertical side portions defining an opening for attracting the chamber and the vacuum into the chamber, the side portions being horizontal side portions extending from the vertical side portions and spaced apart from the upper portion. Collet.
    [15" claim-type="Currently amended] The method of claim 9,
    The means for mapping the surface of the collet to the shaped substrate has a surface of the collet defining an opening and is configured to be adjustable at an angle corresponding to the angle of the shaped substrate surfaces inclined in the direction of movement and movable relative to the body. Collet.
    [16" claim-type="Currently amended] The method of claim 15,
    The fuselage has an upper portion and a vertical side portion defining a chamber and defining an opening for attracting a vacuum in the chamber.
    [17" claim-type="Currently amended] The method of claim 15,
    The body has spaced horizontal side portions, the movable surfaces of the collet have movable end portions of the horizontal side portions, and the movable end portions are configured to substantially coincide with the angle of the shaped substrate. And the movable end portions are spaced at a distance corresponding to the dimensions of the shaped substrate surfaces that are inclined in the direction of motion.
    [18" claim-type="Currently amended] The method of claim 17,
    And the movable end portions are hinged to rotate about the ends of the horizontal side portions.
    [19" claim-type="Currently amended] The method of claim 18,
    The fuselage further comprises a side portion perpendicular to the upper portion, the vertical side portion connecting the upper portion to horizontal side portions defining a chamber and an opening for attracting a vacuum pressure in the chamber. .
    [20" claim-type="Currently amended] The method of claim 19,
    A collet characterized in that the horizontal side parts are movably connected to the vertical side parts.
    [21" claim-type="Currently amended] The method of claim 20,
    A collet, wherein the horizontal side portions are hinged to the vertical side portions.
    [22" claim-type="Currently amended] The method of claim 9,
    The collet is characterized in that it is adapted for use with a gallium nitride based light emitting diode having a shaped substrate of silicon carbide.
    [23" claim-type="Currently amended] The method of claim 9,
    The collet is adapted for use with a silicon carbide shaped substrate having a three-dimensional portion and a topped pyramid portion proximate to the three-dimensional portion and a means for countermeasure is provided on the sidewall of the topped pyramid portion of the shaped silicon carbide substrate. And a means for mating the surface of the collet.
    [24" claim-type="Currently amended] A collet for bonding a light emitting diode having a shaped substrate to a submount, comprising:
    Fuselage with chamber;
    An opening in the fuselage in communication with the chamber configured to extend into the chamber without a portion of the shaped substrate being in contact with the fuselage; And,
    And means operatively associated with the chamber, the means engaging the substrate to bond the light emitting diode to the submount while maintaining the internal shear force of the substrate below the shear yield threshold of the substrate.
    [25" claim-type="Currently amended] The method of claim 24,
    The interlocking means comprises a collet having a stationary surface of the collet disposed at an angle corresponding to the surface angle of the shaped substrate inclined in the direction of motion and defining the opening.
    [26" claim-type="Currently amended] The method of claim 25,
    The fuselage has a side portion perpendicular to the upper portion, the vertical side portion defining a chamber and an opening for attracting a vacuum in the chamber.
    [27" claim-type="Currently amended] The method of claim 25,
    The fuselage has a spaced side portion defining an opening, the fixed surface of the collet has an angled surface at the end of the side portion, and the side portion is a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of movement. Collet, characterized in that spaced apart.
    [28" claim-type="Currently amended] The method of claim 27,
    The body further comprises a chamber and an upper portion defining an opening for attracting a vacuum in the chamber, wherein the side portions are vertical side portions.
    [29" claim-type="Currently amended] The method of claim 27,
    The fuselage further comprises an upper portion and vertical portions and an opening for attracting a vacuum in the chamber, wherein the side portions are horizontal side portions extending from vertical side portions and spaced apart from the upper portion.
    [30" claim-type="Currently amended] The method of claim 24,
    The engaging means comprises a movable surface of the collet configured to be adjusted at an angle corresponding to the surface angle of the shaped substrate inclined in the direction of movement and defining the opening.
    [31" claim-type="Currently amended] The method of claim 30,
    The fuselage has an upper portion and a vertical side portion defining an opening that draws the chamber and the vacuum into the chamber.
    [32" claim-type="Currently amended] The method of claim 30,
    The body has spaced horizontal side portions, the movable surfaces of the collet have movable end portions of the horizontal side portions, and the movable end portions are configured to substantially coincide with the angle of the shaped substrate. And the movable end portions define an opening by being spaced at a distance corresponding to the dimension of the shaped substrate surfaces inclined in the direction of motion.
    [33" claim-type="Currently amended] The method of claim 32,
    And the movable end portions are hinged to rotate about the ends of the horizontal side portions.
    [34" claim-type="Currently amended] The method of claim 33, wherein
    The fuselage further comprises an upper portion and an opening for attracting a vacuum in the chamber and vertical side portions connecting the upper portion to horizontal side portions.
    [35" claim-type="Currently amended] The method of claim 34, wherein
    And the horizontal side portions are movably connected to the vertical side portions.
    [36" claim-type="Currently amended] 36. The method of claim 35 wherein
    And the horizontal side portions are hinged to the vertical side portions.
    [37" claim-type="Currently amended] A collet for bonding a light emitting diode to a submount,
    A fuselage having a chamber therein;
    An opening in the fuselage in communication with the chamber and configured to receive a light emitting diode; And,
    A fixed surface of the collet in the opening in contact with the shaped substrate of the light emitting diode, the fixed surface of the collet being disposed at an angle corresponding to the surface angle of the shaped substrate which defines the opening and is inclined in the direction of movement of the collet during bonding. A collet having a surface;
    [38" claim-type="Currently amended] The method of claim 37,
    The fuselage has an upper portion and a vertical side portion defining an opening that draws the chamber and the vacuum into the chamber.
    [39" claim-type="Currently amended] The method of claim 37,
    The body has spaced side portions, the fixed surface of the collet has an angled surface at the distal end of the side portion, and the side portions are spaced at a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of motion. Collet characterized by.
    [40" claim-type="Currently amended] The method of claim 39,
    The body further comprises an opening for attracting a vacuum in the chamber and an upper portion defining the chamber, wherein the side portions are vertical side portions.
    [41" claim-type="Currently amended] The method of claim 39,
    The body further has an upper side and vertical side portions defining a chamber and an opening for inducing vacuum in the chamber, the side portions being horizontal side portions extending from the vertical side portions and spaced from the upper portions. Collet characterized.
    [42" claim-type="Currently amended] A collet for thermally ultrasonically bonding a light emitting diode to a submount,
    A fuselage having a chamber therein;
    An opening in communication with the chamber and configured to receive a light emitting diode; And,
    A movable surface of the collet in the opening that is movable relative to the fuselage and in contact with the shaped substrate, the movable surface being configured to be adjusted to an angle corresponding to the surface angle of the shaped substrate that is inclined to the direction of movement of the collet during bonding. A collet having a surface;
    [43" claim-type="Currently amended] The method of claim 42,
    The fuselage has an upper portion and a vertical side portion defining a chamber and an opening for introducing a vacuum into the chamber.
    [44" claim-type="Currently amended] The method of claim 42,
    The fuselage has a spaced horizontal side portion and the movable surface of the collet has a movable end portion of the horizontal side portion, and the movable portion is configured to substantially fit the angle of the shaped substrate. Collet, characterized in that the end portions are spaced at a distance corresponding to the surface dimension of the shaped substrate inclined in the direction of movement.
    [45" claim-type="Currently amended] The method of claim 44,
    And the movable end portion is hinged to rotate at two of the ends of the horizontal side portions.
    [46" claim-type="Currently amended] The method of claim 45,
    The fuselage further comprises a top portion defining a chamber and an opening for inducing vacuum in the chamber, and a vertical side portion connecting the top portion to a horizontal side portion.
    [47" claim-type="Currently amended] The method of claim 46,
    And the horizontal side portions are movably connected to the vertical side portions.
    [48" claim-type="Currently amended] The method of claim 47,
    And the horizontal side portions are hinged to the vertical side portions.
    [49" claim-type="Currently amended] A system for thermosonically bonding a light emitting diode having a shaped substrate to a submount, the system comprising:
    Means for engaging the substrate while maintaining an internal shear force of the substrate below a shear yield threshold when a force is applied to the shaped substrate to thermally bond the light emitting diode to the submount; And,
    And means for moving the engaging means to apply a force that thermally ultrasonically bonds the light emitting diode to the substrate.
    [50" claim-type="Currently amended] The method of claim 49,
    The engaging means includes means for contacting the shaped substrate on the surface of the shaped substrate inclined in the direction of motion of the shaped substrate.
    [51" claim-type="Currently amended] 51. The method of claim 50 wherein
    And the contact means has a wall of collet in a fixed position relative to the body of the collet, the collet being configured to receive a light emitting diode.
    [52" claim-type="Currently amended] 51. The method of claim 50 wherein
    The contact means having a wall of collets movable relative to the body of the collet, the collet being configured to receive a light emitting diode.
    [53" claim-type="Currently amended] A collet for bonding a light emitting diode having a shaped substrate to a submount,
    A fuselage having a chamber;
    An opening adapted to be in communication with the chamber and to receive a light emitting diode, the opening comprising: an opening having a portion proximate to the chamber and a portion distal to the chamber; And,
    And a corresponding surface disposed at an angle with respect to the axially connected end portion of the opening associated with the opening and corresponding to the surface of the shaped substrate.
    [54" claim-type="Currently amended] The method of claim 53, wherein
    And the corresponding surface is a stationary surface of the collet defining an opening and disposed at an angle corresponding to the surface angle of the shaped substrate.
    [55" claim-type="Currently amended] The method of claim 54, wherein
    The body has a collet having an upper portion and vertical side portions defining a chamber and an opening for introducing a vacuum into the chamber.
    [56" claim-type="Currently amended] The method of claim 54, wherein
    The fuselage has spaced side portions defining the chamber, the fixed surface of the collet has an angled surface at the end of the side portion, and the side portion corresponds to the surface dimensions of the shaped substrate to which the fixed surface corresponds. Collet, characterized in that spaced apart.
    [57" claim-type="Currently amended] The method of claim 56, wherein
    The body further comprises an upper portion and an opening for inducing vacuum pressure in the chamber, wherein the side portion is a vertical side portion.
    [58" claim-type="Currently amended] The method of claim 56, wherein
    The body has an upper portion and a vertical side portion defining a chamber and an opening for inducing vacuum in the chamber, the side portions being horizontal side portions extending from vertical side portions and spaced apart from the upper portion. Collet.
    [59" claim-type="Currently amended] The method of claim 53, wherein
    The corresponding surface has a surface of the collet defining the opening and is movable relative to the fuselage and the surface of the collet defining the opening is configured such that the surface of the collet defining the opening is adjusted to an angle corresponding to the surface angle of the corresponding shaped substrate. A collet having a surface.
    [60" claim-type="Currently amended] The method of claim 59,
    The fuselage has an upper portion and a vertical side portion defining a chamber and an opening for introducing a vacuum into the chamber.
    [61" claim-type="Currently amended] The method of claim 59,
    The fuselage has a spaced horizontal side portion and the movable surface of the collet has a movable end portion of the horizontal side portion, the movable end portion configured and substantially movable to the angle of the shaped substrate. And the moveable end portions are spaced apart by a distance corresponding to the surface dimension of the corresponding shaped substrate.
    [62" claim-type="Currently amended] 62. The method of claim 61,
    And the movable end portions are hinged to rotate about the ends of the horizontal side portions.
    [63" claim-type="Currently amended] The method of claim 62,
    The fuselage further comprises an upper portion and a vertical side portion connecting the upper portion to a horizontal side portion, the horizontal side portion defining a chamber and an opening for inducing vacuum pressure in the chamber.
    [64" claim-type="Currently amended] The method of claim 63, wherein
    And the horizontal side portions are movably connected to the vertical side portions.
    [65" claim-type="Currently amended] The method of claim 64, wherein
    And the horizontal side portions are hinged to the vertical side portions.
    [66" claim-type="Currently amended] The method of claim 53, wherein
    The collet is characterized in that it is adapted for use with a gallium nitride based light emitting diode having a shaped substrate of silicon carbide.
    [67" claim-type="Currently amended] The method of claim 53, wherein
    The collet is adapted for use with a silicon carbide shaped substrate having a topped pyramid portion and the corresponding surfaces correspond with the angled sidewalls of the topped pyramid portion of the shaped silicon carbide substrate.
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    同族专利:
    公开号 | 公开日
    TW557588B|2003-10-11|
    JP2005510042A|2005-04-14|
    CA2454735A1|2003-02-06|
    CN1557014A|2004-12-22|
    WO2003010798A2|2003-02-06|
    AT548752T|2012-03-15|
    JP4594618B2|2010-12-08|
    MY138237A|2009-05-29|
    US6747298B2|2004-06-08|
    WO2003010798A3|2003-10-16|
    US20030042507A1|2003-03-06|
    EP1410426B1|2012-03-07|
    US20040200882A1|2004-10-14|
    US7341175B2|2008-03-11|
    EP1410426A2|2004-04-21|
    CN1305108C|2007-03-14|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-07-23|Priority to US30723401P
    2001-07-23|Priority to US60/307,234
    2002-06-27|Priority to US10/185,350
    2002-06-27|Priority to US10/185,350
    2002-07-22|Application filed by 크리 인코포레이티드, 크리 마이크로웨이브 인크.
    2002-07-22|Priority to PCT/US2002/023067
    2004-04-06|Publication of KR20040029382A
    优先权:
    申请号 | 申请日 | 专利标题
    US30723401P| true| 2001-07-23|2001-07-23|
    US60/307,234|2001-07-23|
    US10/185,350|US6747298B2|2001-07-23|2002-06-27|Collets for bonding of light emitting diodes having shaped substrates|
    US10/185,350|2002-06-27|
    PCT/US2002/023067|WO2003010798A2|2001-07-23|2002-07-22|Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates|
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